Technical parameters
Laser channel:16CH
Max.engraving plate size:330×430mm
Max.engraving plate size:80×80mm
Laser power:High power semiconductor laser diode
Plate thickness:0.15mm 0.95mm 1.14mm 1.7mm
Laser power:High power semiconductor laser diode
Plate type:Heat corrosive film,thermal PS plate,digital letterpress,
digital flexo plate,digital steel based plate(Aura M600 magnetic drum CTP)
Publication speed
Standard output speed:1.25m2/h full mold print
Optical accuracy:4000dpi
Repetition alignment precision: ±3µm
Absolute alignment precision: ±15µm
Focus adjust:Autofocus
Device size:830×630×1030mm(W×D×H)
Net weight:About 280kg
Power:Mainframe 0.5KW+Vacuum 1.5KW
Recommended ambient temperature:20~25℃,
Allowable temperature:18-26℃
Relative humidity:<70%
Technical parameters
Laser channel:16CH
Max.engraving plate size:330×430mm
Max.engraving plate size:80×80mm
Laser power:High power semiconductor laser diode
Plate thickness:0.15mm 0.95mm 1.14mm 1.7mm
Laser power:High power semiconductor laser diode
Plate type:Heat corrosive film,thermal PS plate,digital letterpress,
digital flexo plate,digital steel based plate(Aura M600 magnetic drum CTP)
Publication speed
Standard output speed:1.25m2/h full mold print
Optical accuracy:4000dpi
Repetition alignment precision: ±3µm
Absolute alignment precision: ±15µm
Focus adjust:Autofocus
Device size:830×630×1030mm(W×D×H)
Net weight:About 280kg
Power:Mainframe 0.5KW+Vacuum 1.5KW
Recommended ambient temperature:20~25℃,
Allowable temperature:18-26℃
Relative humidity:<70%